lead-free parts pb super bright round type led lamps ligitek electronics co.,ltd. property of ligitek only LSEF2040-PF data sheet doc. no : qw0905-LSEF2040-PF-08 rev. : a date : 14 - may - 2007
directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. part no. LSEF2040-PF page 1/5 package dimensions ligitek electronics co.,ltd. property of ligitek only 25.0min 4.0 3.0 0.5 typ 2.54typ 1.0min 1.5max 5.2 4.2 25% 75% 100%50% -60 -30 75% 25% 0 50%100% 0 30 60 + -
605 * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. page 2/5 unit ma mw ma 25 65 60 symbol i f pd i fp ligitek electronics co.,ltd. property of ligitek only ratings orange part no. LSEF2040-PF parameter peak forward current duty 1/10@10khz power dissipation forward current absolute maximum ratings at ta=25 a v 10 ir t opr esd tstg -40 ~ +85 -40 ~ +100 2000 typ. 150036 min. 900 min. 1.7 max. 2.6 17 lens emitted orange orangediffused color forward voltage @20ma(v) spectral halfwidth nm viewing angle 2 1/2 (deg) luminous intensity @20ma(mcd) dominant wave length dnm reverse current @5v storage temperature material algainp part no LSEF2040-PF note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) operating temperature electrostatic discharge( * )
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0 10 20 1.0101001000 0.0 1.0 2.0 3.0 -200204060 1.0 1.1 1.2 2.03.0 80 0.8 0.9 -20 40 20 080 60 2.0 0.0 0.5 1.0 1.5 2.5 page 3/5 typical electro-optical characteristics curve sef chip 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 500 0.0 0.5 550 600 650 0.51.52.5 0 30 50 40 60 part no. LSEF2040-PF
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. page 4/5 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) time(sec) 150 260 c3sec max 100 5 /sec max 50 preheat 2 /sec max 260 120 0 0 25 temp( c) part no. LSEF2040-PF
page 5/5 reference standard this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description test condition 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) ligitek electronics co.,ltd. property of ligitek only mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 test item operating life test high temperature storage test reliability test: the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec jis c 7021: b-12 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202:103b jis c 7021: b-11 low temperature storage test high temperature high humidity test thermal shock test solder resistance test solderability test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. part no. LSEF2040-PF
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